In recent years, the popularization of E-Mobility implementation and the rise of the IoT/IoV, a large number of electronic components have been applied to automobiles, and all relevant supply chains are actively approaching the market. PCB(Printed-Circuit Board) is a key part among these electronic components. In order to ensure highly reliable products, automotive PCB has to verify the quality and follows, not only the international standard IPC-6012DA, IPC (Association Connect Electronics Industries) issued for automotive PCB, but also specific requirements developed by various vehicle companies or Tier 1 suppliers.
In the experience of automotive PCB verification, DEKRA iST has surpassed general quality issues in PCB, via a couple of key validated tests, as below:
A. Connected Issue：The most commonly connected issues are Plating Through Hole (fig.1) and cracked Blind(fig. 2) or Buried Hole, causing an abnormal, electrical open circuit.
| Fig. 1 Cracked Plating Through Hole wall|| Fig. 2 Blind Hole cracked at the bottom|
B. Insulation Issue: The most common issues resulting from poor surface insulation or abnormalities in process/materials are decreased insulation resistance to cause poor insulation. The extent of serious electrical anomalies caused by short circuits can be seen in fig.3 & fig.4.
|Fig.3 Abnormal Insulation between the surface traces||Fig.4 Conductive Anodic Filament(CAF)between via holes|
C、Delamination/Laminate crack Issue:The implementation of lead-free assembly process for automotive PCB is late, but it is a necessary process to commit the concept of environmental protection. During the transferring, the delamination and laminate crack issue of automotive PCB is the same as general PCB, therefore, the materials and processes of current automotive PCB must be adjusted to achieve high reliability.
| Fig.5 Reflow simulation facility|| Fig.6 Delamination image of PCB through SAT|
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