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PCB Failure Analysis

In the past, cross-sectioning is the major resort for the failure analysis of PCBs. When products get thinner and smaller and high-end multi-layer configuration becomes the mainstream, a failure analysis that only relies on cross-sectioning is no longer adequate. In addition, due to lengthy procedures in the PCB production, disputes continued endlessly, arguing whether user-end failures derived from the assembly process or resulted from PCB raw materials. 


We apply advanced technologies for analyzing PCB products, such as Focused Ion Beam (FIB) for analyzing micro structures, preventing micro problems from being blurred by the ductile copper material in PCB cross-section process. Auger Electron Spectroscopy  (Auger) is used for analyzing existence of trace substances, assisting the customer finding root causes of product defects, it is especially effective for surface analyses. Scanning Electron Microscopy and Energy Dispersive Spectrometer (SEM/EDS) are effective tools for verifying Black Pad causes, minimizing production and assembly risks, and clarifying early failure issues. In addition, equipment including Thermal Mechanical Analyzer (TMA), Atomic Force Microscope (AFM), is very helpful to PCB analyses.


We provide high-tech equipment for carrying out analyses, and expert consultations assisting customers to clarify application problems and implement product improvement solutions. With comprehensive field experiences, we provides customers with various consultation services.

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