An X-Ray is produced using a cathode ray tube to generate high energy electrons to collide with a metal target. The energy of the electrons is converted into X-Ray during the collision with metal target. The X-Ray has very short wave length and high electromagnetic radiation.
When the sample location cannot be inspected using external appearance related metrology tools, X-Ray imaging can be used to detect the internal structure of the sample due to its intensity change as a function of material density. This contrast image can show the internal structure of the sample without any physical destruction to the diagnosed region.
Defect inspection in IC packaging﹕layer delamination, burst Crack, void, and bonding inspection.
Potential defects in the PCB manufacturing process e.g.: mis-alignment, bridge or open circuit.
SMT solding void inspection and measurement.
Defect inspection of open, short or abnormal connections in the interconnect.
Solder ball array inspection in BGA packaging and flip chip packaging.
Inspection of crack in high density plastic material or void in metal.
Chip dimension measurement, wire arc measurement, solding percentage measurement.
Aluminum wires or low density materials used in IC packaging are not applicable to X-Ray inspection.