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Thermal Cycling / Shock Test

Product Details

Thermal Cycling Test

Temperature range: -70°C ~ +150°C (depends on test conditions and test specifications)

Temperature alteration: 1°C ~ 30°C /min. (depends on test conditions and test specifications)

Scope of application: 

   Environment simulation tests of Modules/Systems and finished goods

   Stress-Life (Strife) tests of Modules/Systems and finished goods

   ALT/AST of PCB/PCBA/ Solder joints…


Common Failure Modes:

   Electrical functionality failure

   PCB Delamination, trace breakage

   Part/solder joint/ substrate cracking

   Material/ structure deformation…


Common tests include:

   Electrical properties of product

   Deterioration of lubricant

   Rupture or crack caused by loss of mechanical strength

   Chemical action resulting from material deterioration 


Thermal Shock Test

Temperature range: -100oC ~ +200oC (depends on test conditions and test specifications)

Temperature alteration cycle: <10s

Scope of application:

   PCB reliability ALT

   Automotive electronic module ALT

   LED element ALT…


 Common failure modes:

   Electrical functionality of product

   Structure damage or reduced strength of product

   PCB burst, solder breakage

   Chemical action resulting from material deterioration 

   Reduced sealing effect



Common tests include:

   Electrical properties of product

   Damaged structure or reduced strength of product

   Solder crack of components

   Deterioration of material caused by a chemical action

   Damaged seal

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